ZS-GF-3161 Two-Part Addition Silicone Potting Compound

ZS-GF-3161 Composé d’enrobage en silicone à ajout en deux parties

ZS-GF-3161 Two-Part Addition Silicone Potting Compound

ZS-GF-3161 Composé d’enrobage en silicone à ajout en deux parties

ZS-GF- 3161 is a low viscosity two-component addition transparent silicone potting compound, which can be cured at room temperature or heated. This product doesn't produce any by-products in the curing reaction. It can be applied to the surface of PC、PP、ABS、PVC and metal's surface, which has good stability under -40 ℃～200 ℃.  It's widely used for led driver and electronic components.
UL,REACH,ROHS,
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Caractéristique du produit
ZS-GF- 3161 is a low viscosity two-component addition molding transparent silicone potting compound, which can be cured at room temperature or heated, with the characteristics of higher temperature and faster curing. This product doesn't produce any by-products in the curing reaction. It can be applied to the surface of PC (poly carbon), PP, ABS, PVC and other materials and metals. It can be used in the environment of - 60 ℃ to 220 ℃. It fully complies with the requirements of RoHS and reach directives of the European Unio
Objectif principal
otting the power modules to protect the modules.
2)Potting the electronic components to protect the
Paramètres techniques

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